The S-8261AAG is presented here with the most relevant datasheet numbers up front: the device supports overcharge detection in the ~3.9–4.5 V range with 5 mV step granularity and voltage-detection accuracy around ±25 mV, combined with integrated delay logic and overcurrent/overdischarge protection. This short report decodes the S-8261AAG datasheet and turns key specs into design and troubleshooting guidance for engineers working on single-cell packs and portable systems. Target Audience Hardware engineers, battery-system designers, and technical writers who need a concise, data-first reference to convert the datasheet into a checklist and test plan. The report emphasizes measurable thresholds, likely battery-life impact, PCB and component choices, and pragmatic verification steps engineers can apply during prototype bring-up. S-8261AAG: Design Overview & Core Functions Pinout, package & basic block diagram Point: The IC typically exposes BAT, V-, VOUT and gate-drive pins plus an exposed thermal pad. Evidence: The package routes cell sense and MOSFET-drive signals through dedicated pins. Explanation: Designers should map BAT to the cell positive, V- to pack negative, and locate the thermal/exposed pad under the part for heat dissipation and reliable soldering. BOM notes: prioritize a footprint with a solid exposed pad and plated-through thermal vias. Protection features at a glance Point: The device integrates overcharge, overdischarge, overcurrent/short protection and auto-recovery behavior. Evidence: Internal comparators, delay circuits and MOSFET-drive logic implement these functions. Explanation: Overcharge/overdischarge thresholds are selectable in defined steps while some trip limits and internal timers are fixed; designers must pick setpoints with margin for cell tolerance and charger behavior to avoid nuisance trips while maintaining safety. S-8261AAG Electrical Specifications & Datasheet Breakdown Voltage detection details: thresholds, accuracy, and step resolution Detection Range (V) Accuracy: ±25 mV 0.0 V 3.9 V 4.5 V Point: Voltage detection supports roughly 3.9–4.5 V with 5 mV step granularity and ≈±25 mV accuracy. Evidence: The datasheet lists detection range, step size and typical accuracy under nominal temperature conditions. Explanation: This fine resolution enables precise charger termination and tight overcharge margins, but engineers must account for ADC tolerances, cell imbalance and measurement offset when selecting setpoints to avoid repeated toggling near thresholds. Current & timing specs: overcurrent thresholds, delay times, and timing diagrams Parameter Typical Performance Design Impact Overcurrent Detection Sense Resistor Triggered Prevents thermal runaway during shorts Delay Logic Integrated Timers Filters transient noise/current spikes Point: Overcurrent/short detection relies on sense resistor measurement and configured delay logic to distinguish pulses from sustained faults. Explanation: Choose sense resistor and delay settings to suppress harmless current spikes while ensuring fast enough response for thermal protection; verification should include both pulse and continuous current tests to validate trip behavior and energy dissipation. Performance Metrics, Thermal & Reliability Considerations Quiescent current, leakage, and battery life impact Point: Quiescent and leakage currents are key for shelf life and wearable applications. Evidence: The datasheet specifies standby drain in the low‑microampere range and leakage paths under protection conditions. Explanation: Estimate pack shelf drain by multiplying quiescent current by time and include inverter losses; recommended verification: long-duration DMM logging and periodic coulomb-count checks to confirm expected µA-range impact on months-long standby life. Thermal behavior & robustness in real use Point: Power dissipation during fault clearing concentrates in MOSFETs and the PCB thermal path. Evidence: The datasheet and block diagram identify FET-drive nodes and the thermal pad as the main heat path. Explanation: Design wide copper pours, multiple thermal vias, and derate FET Rds(on) at elevated temperature; include temperature cycling and sustained overcurrent soak tests in reliability checks to reveal marginal soldering or thermal runaway risk. Implementation Guide: PCB Integration & Application Circuit Tips Typical application circuit and layout best practices Point: The canonical single-cell application uses a sense resistor, back-to-back MOSFETs and bypass paths for charge/discharge. Evidence: Application diagrams place the sense resistor between V- and pack negative with MOSFETs controlled by gate-driver pins. Explanation: Layout priorities are short sense traces, ground-return segregation, and placing decoupling close to BAT; ensure wide copper for current paths and thermal vias under the exposed pad for heat spreading. Component selection: MOSFETs, sense resistors, and external filtering Point: Choose MOSFETs and sense resistors to balance conduction loss and detection resolution. Evidence: Datasheet timing and threshold behavior depend on the voltage drop across the sense resistor and FET Rds(on). Explanation: Use low Rds(on) FETs with adequate Vds margin and a sense resistor tolerance that preserves detection accuracy; add RC filtering only when needed to avoid slowing legitimate fault detection—verify with pulse tests. Use Cases, Troubleshooting & Quick Design Checklist Typical application scenarios & quick comparisons Point: Common targets include consumer handhelds, wearables and portable instruments where low part count and accurate thresholds matter. Explanation: For wearables prioritize lowest quiescent current and smallest footprint, while instruments may prioritize higher sustained discharge capability and thermal margin—select components accordingly. Troubleshooting flow & quick verification checklist ✔ confirm BAT/V- reference voltages ✔ log quiescent current ✔ apply calibrated pulses to validate timing ✔ inspect solder joints and thermal vias Summary 1 The S-8261AAG provides fine-grain voltage detection (3.9–4.5 V, 5 mV steps) and ≈±25 mV accuracy, enabling precise charger termination and tight protection margins for single-cell designs using this battery IC. 2 Integrated delay logic and MOSFET drive simplify BOM and reduce firmware complexity, but designers must validate trip timing with both pulse and continuous loads to avoid false trips. 3 Quiescent and leakage currents are low (µA-range typical), so long-term shelf drain is small if verified with extended logging; thermal vias and copper pour are critical for robustness. 4 Recommended next step: consult the official datasheet for exact tables and timing diagrams labeled “datasheet” and execute a short prototype test plan covering threshold validation and thermal soak. FAQ How does S-8261AAG handle charger termination and what datasheet items to verify? + The S-8261AAG uses fine voltage steps and accurate thresholds to detect full-charge; verify the threshold table and voltage accuracy entries in the datasheet, then test with a regulated charger and a precision meter. Confirm hysteresis and delay behavior to ensure stable termination without oscillation. What battery IC measurements should be captured during bring-up for S-8261AAG? + Key measurements include quiescent current over 24–72 hours, sense-resistor voltage drop under defined loads, trip timing for overcurrent events, and thermal rise during sustained discharge. Record each measurement with calibrated instruments and compare against datasheet typical/maximum values. How to debug frequent false trips with S-8261AAG? + Start by measuring the sense-node waveform with an oscilloscope during the event to distinguish pulses from sustained faults. Check layout for long sense traces, verify sense-resistor tolerance, and confirm delay settings. If needed, increase hysteresis or adjust the sense resistor and re-run pulse-vs-continuous tests to tune reliability.

An essential engineering guide for rapid power design assessment and implementation. This deep dive extracts the critical figures engineers need from the device datasheet so you can judge suitability for power designs in minutes. It focuses on voltage/current limits, RDS(on), switching characteristics, thermal ratings, and the full pinout—helping you quickly locate, interpret, and apply those values during schematic and PCB work. Purpose: Enable fast decisions—identify headline specs, run quick conduction and switching loss checks, and place the device correctly in layout based on datasheet tables and mechanical drawings. Part Overview & Key Specs at a Glance Functional Description This device is a power MOSFET intended for switching applications. Classified as a low-RDS(on) switching transistor, it features optimized gate thresholds and charge. It is ideal for synchronous buck stages, motor drivers, and high-speed switches where low conduction loss and defined gate-drive energy are mandatory. Application Target Optimized for efficiency in power conversion. The electrical, switching, and thermal parameters are organized to facilitate initial feasibility checks and BOM (Bill of Materials) comparison during the design phase. Key Parameter Dashboard 60 V Max VDS 60 A Max ID 20 mΩ Typ RDS(on) 175°C Max Tj Parameter Typical / Specification Datasheet Location VDS (max) 60 V Absolute Ratings Table ID (continuous) 30–60 A DC Characteristics Table Pulsed Current Peak Pulse as specified Absolute Ratings / Pulse Ratings RDS(on) Typ/Max @ 10V VGS On-state Resistance Table Total Gate Charge (Qg) 40–80 nC Switching Characteristics Package / Thermal θJA / θJC Mechanical / Thermal Info Electrical Characteristics: DC & Switching Parameters DC Parameters Prioritize RDS(on), Vth, ID rating, and leakage. Use worst-case RDS(on) at elevated temperatures for conduction loss estimates. The datasheet typically provides a temp coefficient to scale resistance from 25°C to the operating Tj. AC / Switching Specs Gate charge (Qg) and capacitances (Ciss) define gate-driver needs. Psw ≈ 0.5 × VDS × ID × (tr+tf) × f Example: VDS=48V, ID=20A, tr+tf=50ns, f=200kHz → Psw ≈ 0.48 W. Pinout, Package, and Mechanical Details Gate (G): High-impedance control Drain (D): Main current input/case Source (S): Current return path Exposed Pad: Thermal & Ground Layout Guidance: Implement thermal vias under the exposed pad (8–20 moderately spaced vias) and increase copper pour to lower θJA. Follow the recommended land pattern precisely to ensure mechanical reliability and optimal solder fillets. Thermal Performance & Safe Operating Area (SOA) Safe Operating Area (SOA): Always cross-reference your V-I operating point with the SOA curves. For repetitive pulses, apply conservative derating—limit continuous current well below pulsed peaks. Verification: ΔTj = Pd × θJA. If Pd = 10 W and θJA = 30 °C/W → ΔTj = 300 °C (requires active cooling or more copper). Application Example: Synchronous Buck Power Stage Design check for ID=30 A and RDS(on)=20 mΩ: Conduction Loss (Pcond) 18.0 W I2 × RDS(on) (30² × 0.02) Place a gate resistor (10–50 Ω) to damp ringing. Include a bootstrap diode for high-side drive. Add a snubber circuit if dV/dt ringing exceeds 80% of VDS rating. Testing & Validation Checklist Bench Verification Measure RDS(on) using Kelvin 4-wire method. Capture switching waveforms with low-inductance probes. Perform thermal imaging under steady-state load. PCB Layout Keep gate traces as short as possible. Decouple power rails directly at Drain/Source. Verify solder reflow profile compatibility. Summary Electrical: Use VDS, ID, and RDS(on) tables to compute conduction and switching losses immediately. Thermal: Extract θJA/θJC to design copper area and via count, ensuring junction limits are never breached. Mechanical: Confirm pinout and footprint from the mechanical section for perfect board alignment and thermal pathing. Frequently Asked Questions What is the best way to verify RDS(on) from the datasheet? + Measure RDS(on) under the datasheet’s specified VGS and temperature. Use a Kelvin four‑wire method or a pulsed test to avoid self-heating. Compare measured values at 25°C and your expected operating temperature, applying any temperature coefficient given in the datasheet. How do I size the gate driver for this device? + Determine Qg from the switching table and choose a driver capable of supplying Peak Current = Qg / desired rise time. Also, check the average current: Iavg ≈ Qg × f. Ensure the drive voltage matches the recommended VGS level and include a resistor to control dV/dt. How should I read the SOA for pulsed operation? + Locate the pulse width nearest your application on the SOA curves. Ensure your operating V-I point falls safely below that curve. For repetitive pulses, further derate to account for thermal accumulation and junction recovery times, validating with thermal measurements.

Interest in the YACT20JE06PNC00100A datasheet has risen as engineering teams evaluate replacements and board-level integration options. This guide summarizes the part identity, concise pinout, electrical and mechanical highlights, practical integration tips, and a procurement checklist so engineers can rapidly assess fit-for-purpose without hunting through multiple distributor listings. Overview: YACT20JE06PNC00100A Datasheet at a Glance Part Identity & Typical Applications The device is a compact semiconductor intended for board-level power/signal management and interface functions. It typically appears in mid-power rails, supervisory circuits, or as an interface translate block. Engineers scanning a BOM will treat it as a small-package, single-function IC—useful in power distribution, rail sequencing, or signal conditioning. It is a small-package interface/power component optimized for compact PCBs and constrained thermal environments. Visual Performance Metrics Voltage Efficiency94% Thermal Stability88% Signal Integrity97% Quick-Spec Summary Spec Typical Value / Range Supply voltage (Vcc) 1.8–5.5 V Max continuous current Up to 2 A (package dependent) Package Small SMT package (e.g., 8-pin DFN/SOP equivalent) Temp range -40°C to +85°C (commercial) / extended options possible Key ratings ESD protection, thermal limit, absolute max Vcc Pinout & Electrical Characteristics A clear pinout table reduces probe time and miswiring risk. Below is a compact example map engineers can adapt to board silkscreen or schematic symbols using consistent naming conventions (VCC, GND, IN, OUT, EN, NC). Pin Name Type Function 1 VCC Power Primary supply input, decouple close to pin 2 GND Power Return, connect to star ground 3 EN I/O Enable input, logic-high enable 4 IN Input Signal or sense input 5 OUT Output Output driver or switched rail 6 NC - No connect / mechanical support 7 TEST I/O Factory/test pin — avoid driving in production 8 PAD Thermal Exposed pad for thermal dissipation Note: include the pinout on the schematic sheet and a labeled PCB silk to speed validation and debug. Mechanical, Package & Environmental Specs Package Dimensions & Layout Accurate mechanical drawings prevent footprint errors. Provide recommended land pattern dimensions with precise tolerances, pad-to-pad spacing, and exposed pad size for thermal relief. Include solder mask clearance and fillet notes; for small DFN-like packages, expose the thermal pad, provide teardrops on thermal vias, and keep decoupling caps within 1–2 mm. Use metric units on US boards when collaborating internationally. Environmental & Reliability Reliability and environmental ratings inform qualification effort. Summarize operating/storage temperature ranges, recommended MSL (if supplied), and theta_JA / theta_JC thermal resistance. Flag parts with tight thermal limits or low MSL ratings that require careful handling; if theta_JA is high, plan for copper pours or thermal vias to meet power dissipation requirements. Integration & Implementation Guide Reference Circuits and Layout Tips + Typical references include power decoupling (0.1 µF + 1 µF near VCC), pull-ups on open-drain lines, and proper termination on high-speed pins. Place decoupling caps as close as possible to VCC and GND pins, route high-current traces wide and short, and keep sensitive analog traces away from switching nodes. Add test pads on critical nets for oscilloscope access. Validation Checklist & Measurement Procedures + A short bench checklist accelerates bring-up. Steps: verify continuity and shorts, apply VCC with current limit, check enable/disable behavior, validate I/O thresholds with a scope, and measure thermal rise at rated current. Use a bench PSU with current limit, a multimeter for DC checks, and a scope with 10:1 probe for waveform validation. Watch for common failure modes: reversed power, missing decoupling, and cold solder joints. Compatibility & Substitution Criteria + Evaluate substitutes systematically. Use a matrix template with rows: pin match, voltage range, current capacity, timing, package/footprint, and thermal dissipation. Only consider a substitute if pin mapping or minimal reroute is feasible, voltages match within thresholds, timing is equivalent, and thermal dissipation is acceptable. Sourcing & Authenticity Verification + Reliable sourcing protects schedules. Request full datasheet, traceability documentation, and certificates of conformance; inspect packaging and markings on receipt. Use authorized channels where possible, check batch codes, inspect moisture-seal packaging, and run sample electrical checks. Procurement must balance cost, lead time, and risk. Summary For engineers needing quick reference, the YACT20JE06PNC00100A datasheet is optimized for rapid assessment. Follow these finalized steps for successful integration: • A concise pinout table and labeled PCB silk reduce assembly and debug time; cross-check signals before reflow. • Prioritize absolute maximums, VCC range, and theta_JA when evaluating thermal headroom and derating strategies. • Follow a strict procurement checklist—request traceability docs and run incoming sample tests to avoid counterfeit risks.

Interest in the YACT20JE06PNC00100A datasheet has risen as engineering teams evaluate replacements and board-level integration options. This guide summarizes the part identity, concise pinout, electrical and mechanical highlights, practical integration tips, and a procurement checklist so engineers can rapidly assess fit-for-purpose without hunting through multiple distributor listings. Overview: YACT20JE06PNC00100A Datasheet at a Glance Part Identity & Typical Applications The device is a compact semiconductor intended for board-level power/signal management and interface functions. It typically appears in mid-power rails, supervisory circuits, or as an interface translate block. Engineers scanning a BOM will treat it as a small-package, single-function IC—useful in power distribution, rail sequencing, or signal conditioning. It is a small-package interface/power component optimized for compact PCBs and constrained thermal environments. Visual Performance Metrics Voltage Efficiency94% Thermal Stability88% Signal Integrity97% Quick-Spec Summary Spec Typical Value / Range Supply voltage (Vcc) 1.8–5.5 V Max continuous current Up to 2 A (package dependent) Package Small SMT package (e.g., 8-pin DFN/SOP equivalent) Temp range -40°C to +85°C (commercial) / extended options possible Key ratings ESD protection, thermal limit, absolute max Vcc Pinout & Electrical Characteristics A clear pinout table reduces probe time and miswiring risk. Below is a compact example map engineers can adapt to board silkscreen or schematic symbols using consistent naming conventions (VCC, GND, IN, OUT, EN, NC). Pin Name Type Function 1 VCC Power Primary supply input, decouple close to pin 2 GND Power Return, connect to star ground 3 EN I/O Enable input, logic-high enable 4 IN Input Signal or sense input 5 OUT Output Output driver or switched rail 6 NC - No connect / mechanical support 7 TEST I/O Factory/test pin — avoid driving in production 8 PAD Thermal Exposed pad for thermal dissipation Note: include the pinout on the schematic sheet and a labeled PCB silk to speed validation and debug. Mechanical, Package & Environmental Specs Package Dimensions & Layout Accurate mechanical drawings prevent footprint errors. Provide recommended land pattern dimensions with precise tolerances, pad-to-pad spacing, and exposed pad size for thermal relief. Include solder mask clearance and fillet notes; for small DFN-like packages, expose the thermal pad, provide teardrops on thermal vias, and keep decoupling caps within 1–2 mm. Use metric units on US boards when collaborating internationally. Environmental & Reliability Reliability and environmental ratings inform qualification effort. Summarize operating/storage temperature ranges, recommended MSL (if supplied), and theta_JA / theta_JC thermal resistance. Flag parts with tight thermal limits or low MSL ratings that require careful handling; if theta_JA is high, plan for copper pours or thermal vias to meet power dissipation requirements. Integration & Implementation Guide Reference Circuits and Layout Tips + Typical references include power decoupling (0.1 µF + 1 µF near VCC), pull-ups on open-drain lines, and proper termination on high-speed pins. Place decoupling caps as close as possible to VCC and GND pins, route high-current traces wide and short, and keep sensitive analog traces away from switching nodes. Add test pads on critical nets for oscilloscope access. Validation Checklist & Measurement Procedures + A short bench checklist accelerates bring-up. Steps: verify continuity and shorts, apply VCC with current limit, check enable/disable behavior, validate I/O thresholds with a scope, and measure thermal rise at rated current. Use a bench PSU with current limit, a multimeter for DC checks, and a scope with 10:1 probe for waveform validation. Watch for common failure modes: reversed power, missing decoupling, and cold solder joints. Compatibility & Substitution Criteria + Evaluate substitutes systematically. Use a matrix template with rows: pin match, voltage range, current capacity, timing, package/footprint, and thermal dissipation. Only consider a substitute if pin mapping or minimal reroute is feasible, voltages match within thresholds, timing is equivalent, and thermal dissipation is acceptable. Sourcing & Authenticity Verification + Reliable sourcing protects schedules. Request full datasheet, traceability documentation, and certificates of conformance; inspect packaging and markings on receipt. Use authorized channels where possible, check batch codes, inspect moisture-seal packaging, and run sample electrical checks. Procurement must balance cost, lead time, and risk. Summary For engineers needing quick reference, the YACT20JE06PNC00100A datasheet is optimized for rapid assessment. Follow these finalized steps for successful integration: • A concise pinout table and labeled PCB silk reduce assembly and debug time; cross-check signals before reflow. • Prioritize absolute maximums, VCC range, and theta_JA when evaluating thermal headroom and derating strategies. • Follow a strict procurement checklist—request traceability docs and run incoming sample tests to avoid counterfeit risks.

Interest in the YACT20JE06PNC00100A datasheet has risen as engineering teams evaluate replacements and board-level integration options. This guide summarizes the part identity, concise pinout, electrical and mechanical highlights, practical integration tips, and a procurement checklist so engineers can rapidly assess fit-for-purpose without hunting through multiple distributor listings. Overview: YACT20JE06PNC00100A Datasheet at a Glance Part Identity & Typical Applications The device is a compact semiconductor intended for board-level power/signal management and interface functions. It typically appears in mid-power rails, supervisory circuits, or as an interface translate block. Engineers scanning a BOM will treat it as a small-package, single-function IC—useful in power distribution, rail sequencing, or signal conditioning. It is a small-package interface/power component optimized for compact PCBs and constrained thermal environments. Visual Performance Metrics Voltage Efficiency94% Thermal Stability88% Signal Integrity97% Quick-Spec Summary Spec Typical Value / Range Supply voltage (Vcc) 1.8–5.5 V Max continuous current Up to 2 A (package dependent) Package Small SMT package (e.g., 8-pin DFN/SOP equivalent) Temp range -40°C to +85°C (commercial) / extended options possible Key ratings ESD protection, thermal limit, absolute max Vcc Pinout & Electrical Characteristics A clear pinout table reduces probe time and miswiring risk. Below is a compact example map engineers can adapt to board silkscreen or schematic symbols using consistent naming conventions (VCC, GND, IN, OUT, EN, NC). Pin Name Type Function 1 VCC Power Primary supply input, decouple close to pin 2 GND Power Return, connect to star ground 3 EN I/O Enable input, logic-high enable 4 IN Input Signal or sense input 5 OUT Output Output driver or switched rail 6 NC - No connect / mechanical support 7 TEST I/O Factory/test pin — avoid driving in production 8 PAD Thermal Exposed pad for thermal dissipation Note: include the pinout on the schematic sheet and a labeled PCB silk to speed validation and debug. Mechanical, Package & Environmental Specs Package Dimensions & Layout Accurate mechanical drawings prevent footprint errors. Provide recommended land pattern dimensions with precise tolerances, pad-to-pad spacing, and exposed pad size for thermal relief. Include solder mask clearance and fillet notes; for small DFN-like packages, expose the thermal pad, provide teardrops on thermal vias, and keep decoupling caps within 1–2 mm. Use metric units on US boards when collaborating internationally. Environmental & Reliability Reliability and environmental ratings inform qualification effort. Summarize operating/storage temperature ranges, recommended MSL (if supplied), and theta_JA / theta_JC thermal resistance. Flag parts with tight thermal limits or low MSL ratings that require careful handling; if theta_JA is high, plan for copper pours or thermal vias to meet power dissipation requirements. Integration & Implementation Guide Reference Circuits and Layout Tips + Typical references include power decoupling (0.1 µF + 1 µF near VCC), pull-ups on open-drain lines, and proper termination on high-speed pins. Place decoupling caps as close as possible to VCC and GND pins, route high-current traces wide and short, and keep sensitive analog traces away from switching nodes. Add test pads on critical nets for oscilloscope access. Validation Checklist & Measurement Procedures + A short bench checklist accelerates bring-up. Steps: verify continuity and shorts, apply VCC with current limit, check enable/disable behavior, validate I/O thresholds with a scope, and measure thermal rise at rated current. Use a bench PSU with current limit, a multimeter for DC checks, and a scope with 10:1 probe for waveform validation. Watch for common failure modes: reversed power, missing decoupling, and cold solder joints. Compatibility & Substitution Criteria + Evaluate substitutes systematically. Use a matrix template with rows: pin match, voltage range, current capacity, timing, package/footprint, and thermal dissipation. Only consider a substitute if pin mapping or minimal reroute is feasible, voltages match within thresholds, timing is equivalent, and thermal dissipation is acceptable. Sourcing & Authenticity Verification + Reliable sourcing protects schedules. Request full datasheet, traceability documentation, and certificates of conformance; inspect packaging and markings on receipt. Use authorized channels where possible, check batch codes, inspect moisture-seal packaging, and run sample electrical checks. Procurement must balance cost, lead time, and risk. Summary For engineers needing quick reference, the YACT20JE06PNC00100A datasheet is optimized for rapid assessment. Follow these finalized steps for successful integration: • A concise pinout table and labeled PCB silk reduce assembly and debug time; cross-check signals before reflow. • Prioritize absolute maximums, VCC range, and theta_JA when evaluating thermal headroom and derating strategies. • Follow a strict procurement checklist—request traceability docs and run incoming sample tests to avoid counterfeit risks.